Overview
Applications
- Leakage current on bare and packaged semiconductor devices
- Backside analysis through silicon
- Resistive shorts on circuit boards
- Power-to-ground short circuits on small, populated circuit boards
Features
- Camera sensitivity (NETD) <20 mK
- Lock-in Thermography heat detection down to 0.0002 °C
- Available lenses: 2 µm, 5 µm, 20 µm, and 80 µm
- Defect depth analysis of stacked die and packaged semiconductor devices
- Microscopic temperature measurement and analysis
- Junction temperature measurement (optional)
- Active device transient temperature measurement (optional)
Base System Components
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Optional Components
System Computers and Software
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MWIR Lenses
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Camera Positioning Components
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Electronic Device & Mini PCB/PCBA Testing Equipment
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System Enclosures & Equipment Racks
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System Warranty
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