Company Overview

Optotherm, Inc. designs and manufactures infrared cameras, optical assemblies, image analysis software, and turn-key infrared camera systems. In 2002, we developed our first thermal imaging system for circuit board failure analysis and have since expanded into semiconductor failure analysis and microscopic thermal analysis.

Sentris Systems

Using high sensitivity Lock-in Thermography fault isolation, Sentris detects and locates low-level heating associated with leakage current and resistive shorts in semiconductors and printed circuit boards. Sentris Lock-in Photometry software detects and locates faults such as latch-ups and gate oxide defects on semiconductor devices by detecting emitted photons in the short wave infrared (SWIR) region of the electromagnetic spectrum. Optotherm provides turnkey failure analysis systems that are configured to each customer's application.

References in Research

Optotherm, Inc. systems are referenced in peer-reviewed research papers and used by leading universities and semiconductor labs.

Tian, F., Zhou, T., Zhang, X., Chen, R., & Chen, S. (2025). Electrically pumped surface-emitting amplified spontaneous emission from colloidal quantum dots. Light: Science & Applications, 14(279). https://www.nature.com/articles/s41377-025-01972-1 

Asuncion, C., Raborar, M., & Mendaros, R. (2025). Non-destructive package-level fault localization in chip-scale package ball-grid array (CSP-BGA) devices through lock-in thermography and time-domain reflectometry (TDR). ASEMEP National Technical Symposium (SEIPI). https://seipi.org.pdf 

Rautio, J., Kärkkäinen, T., Niemelä, M., Silventoinen, P., Lohtander, L., Leppänen, J., & Ingman, J. (2025). Impeding dendritic corrosion in silicone gel potted power modules through surface heating. IET Power Electronics, 18(1). https://ietresearch.onlinelibrary.wiley.com 

Bhatti, H. (2025). On-chip calibration of microscale thermocouples for precise temperature measurement. arXiv. https://arxiv.org/pdf 

Bhatti, H. (2025). Monolithic integration and calibration of micro-thin film thermocouples for in situ thermal characterization of wide and ultrawide bandgap semiconductor devices. KAUST Research Repository.https://repository.kaust.edu 

Li, L., Gao, B., Chen, T., Ng, C., Wang, Y., Huang, Q., Sun, K., Shou, Y., Ma, Y., Chen, H., & Li, Y. (2025). Omnidirectional circularly polarized thermal radiation enabled by chiral metasurface. Small Structures. https://onlinelibrary.wiley.com

Bhatti, H., Yuvaraja, S., Wang, C., Tang, X., & Li, X. (2024). Monolithic integrated micro-thin-film thermocouples for on-chip temperature measurement of GaN HEMPTs. IEEE Transactions on Electron Devices, 71(12). https://ieeexplore.ieee.org

Li, J., Li, J., Liu, H., & Yi, F. (2024). Phonon-mediated infrared plasmonic metamaterial emitters towards high-capacity multifunctional encoding and display. Optics Express, 32(16). https://opg.optica.org

Stoukatch, S., Dupont, F., Laurent, P., & Redouté, J. (2023). Package design thermal optimization for metal-oxide gas sensors by finite element modeling and infra-red imaging characterization. Materials, 16(18), 6202. https://doi.org

Tiwary, N., Ross, G., Vuorinen, V., & Paulasto-Kröckel, M. (2022). Impact of inherent design limitations for Cu–Sn SLID microbumps on its electromigration reliability for 3D ICs. IEEE Transactions on Electron Devices, 70(1), 222–229. https://ieeexplore.ieee.org

Leppänen, J., Ross, G., Vuorinen, V., Ingman, J., Jormanainen, J., & Paulasto-Kröckel, M. (2021). A humidity-induced novel failure mechanism in power semiconductor modules. Microelectronics Reliability, 120.https://www.sciencedirect.com

Chen, Y., Li, M., Yan, W., Zhuang, X., Wei, K., & Cheng, X. (2021). Sensitive and low-power metal oxide gas sensors with a low-cost microelectromechanical heater. ACS Omega. https://pubs.acs.org

Li, J., Li, J., Zhou, H., Zhuang, G., Liu, H., Wang, S., & Yi, F. (2021). Plasmonic metamaterial absorbers with strong coupling effects for small pixel infrared detectors. Optics Express, 29(15). https://opg.optica.org

Xu, R., & Lin, Y. (2020). Tunable infrared metamaterial emitter for gas sensing application. Nanomaterials, 10(8), 1442. https://www.mdpi.com

Qi, Y., Zhu, Y., Zhang, J., Lin, X., Cheng, K., Jiang, L., & Yu, H. (2018). Evaluation of LPCVD SiNx gate dielectric reliability by TDDB measurement in Si-substrate-based AlGaN/GaN MIS-HEMT. IEEE Transactions on Electron Devices, 65(5), 1759–1764. https://ieeexplore.ieee.org

Yao, Y., An, Y., Tu, K.N., & Liu, Y. (2024). Influence factors of joule heating in microbump in advanced packaging technology. 2024 25th International Conference on Electronic Packaging Technology (ICEPT). https://ieeexplore.ieee.org 

Stoukatch, S., Fagnard, J., Roy, G., Laurent, P., Dupont, F., Jacques, P., & Redouté, J. (2022). Thermal conductivity characterization of an in-house formulated thermal insulating xerogel-epoxy composite adhesive for electronics applications. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). https://ieeexplore.ieee.org