Our Story

In 2002, we developed our first thermal imaging system for circuit board failure analysis and have since expanded into semiconductor failure analysis and microscopic thermal analysis.

In order to create tightly integrated systems including both hardware and software, we design and manufacture our own line of long wavelength thermal imaging cameras, infrared lenses, thermoelectric controllers, and image analysis/testing software.  We are currently developing a new line of short wavelength InGaAs cameras for use in semiconductor failure analysis and testing.

Our manufacturing facility is located in Sewickley, PA, USA.