Compare Sentris Systems
System | Sentris FA-MWMWIR Lock-in Thermography IC Failure Analysis
| Sentris FA-LWLWIR Lock-in Thermography IC Failure Analysis
| Sentris FA-SWPhoton Emission IC Failure Analysis
| Sentris RD-MWActive Semiconductor Device Analysis
| Sentris PCB-LWLWIR Printed Circuit Board Troubleshooting
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Applications | Detect low-level leakage current and resistive shorts | Detect leakage current and resistive shorts | Detect leakage, latch-up sites and transistor failures that emit short-wavelength infrared (SWIR) photons | Junction temperature measurement and transient analysis | Detect short circuits, power/ground shorts, faulty/stressed components and open circuits |
Features | Lock-in Thermography fault isolation down to 0.0001 °C | Lock-in Thermography fault isolation down to 0.001 °C | Lock-in Photometry fault isolation with blackout enclosure | Maximum frame rate 1550 Hz | Lock-in Thermography heat detection down to 0.001 °C for boards up to 18 x 24 inches |
Spectral Response | 3.7 – 4.8 µm (With backside analysis through partially transparent silicon) | 7 - 14 µm | 0.9 - 1.7 µm | 3.7 – 4.8 µm (With backside analysis through partially transparent silicon) | 7 - 14µm |
Pixel Resolution | 1 µm max (< 20 mK camera sensitivity for all lenses) | 5 µm max (camera sensitivity decreases with higher magnification lenses) LWIR Lens Specs | 300 nm max (camera sensitivity increases with higher magnification lenses) SWIR Lens Specs | 1 µm max (< 20 mK camera sensitivity for all lenses) | 5 µm max (camera sensitivity decreases with higher magnification lenses) |
