Overview
Applications
- Leakage current on bare and packaged semiconductor devices
- Resistive shorts on circuit boards
- Power-to-ground short circuits on small populated circuit boards
Features
- Camera sensitivity (NETD) <40mK
- Lock-in Thermography heat detection down to 0.001 °C
- Available lenses: 5 µm, 10 µm, 20 µm, 40 µm, 80 µm, and focusable WFOV
- Defect depth analysis of stacked die and packaged semiconductor devices
- Microscopic temperature measurement and analysis
Base System Components
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Optional Components
System Computers and Software
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LWIR Lenses
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Camera Positioning Components
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Electronic Device & Mini PCB/PCBA Testing Equipment
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System Enclosures & Equipement Racks
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System Warranty
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