Device Flip Probing Platform

PN0335 is used to probe a device or wafer and flip to image the opposite side. Devices are mounted in magnetic chucks made of non-conductive Delrin. Terminal blocks manage voltage source and probe lead connections so the platform can flip upside down. The platform accommodates devices up to 80 mm wide.

Applications

  • Flip chip ball grid array analysis

  • Backside analysis

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Overview

Specifications

Setup

Operation

Troubleshoot

Maintenance

    Overview

Included Components

Required Products


Related Products

Manufacturer Information


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    Specifications

Net weight 6.4kg
Dimensions 35.5 x 20 x 18cm
Maximum device size (for die holders) 80 x 80mm

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    Setup

Installation

The platform base can be mounted in the following configurations:

  • Connect to the mounting table using the four (4) M6 thumbscrews provided.

  • Connect to the XY Device Stage using the four (4) M4 thumbscrews provided.

Lens Damage: The thermal camera may need to be raised when flipping the platform to prevent striking the lens.

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    Operation

 

    Troubleshoot


    Maintenance