Device Flip Probing Platform
PN0335 is used to probe a device or wafer and flip to image the opposite side. Devices are mounted in magnetic chucks made of non-conductive Delrin. Terminal blocks manage voltage source and probe lead connections so the platform can flip upside down. The platform accommodates devices up to 80 mm wide.
Applications
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Flip chip ball grid array analysis
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Backside analysis
Overview
Included Components
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Magnetic 304 stainless steel platform
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Set of 4 die holders
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Set of 4 terminal blocks (4-position)
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Terminal block test leads
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Mounting hardware
Required Products
Related Products
Manufacturer Information
Specifications
| Net weight | 6.4kg |
| Dimensions | 35.5 x 20 x 18cm |
| Maximum device size (for die holders) | 80 x 80mm |
Setup
Installation
The platform base can be mounted in the following configurations:
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Connect to the mounting table using the four (4) M6 thumbscrews provided.
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Connect to the XY Device Stage using the four (4) M4 thumbscrews provided.
Operation
Troubleshoot
Maintenance