Research References: Semiconductor Failure Analysis & Reliability

Optotherm infrared imaging systems have been mentioned in peer-reviewed publications featuring semiconductor device reliability.

31st ASEMEP National Technical Symposium | 2025

Non-Destructive Package-Level Fault Localization in CSP-BGA Devi​ces references Optotherm’s high-resolution lock-in thermography system as a critical tool for precise, non-destructive fault localization in advanced semiconductor packages.

seipi.org.ph/wp-content/uploads/2025/05/NON-DESTRUCTIVE-PACKAGE-LEVEL-FAULT-LOCALIZATION-IN-CHIP-SCALE-PACKAGE-BALL-GRID-ARRAY-CSP-BGA-DEVICES.pdf 


IET Power Electronics | 2025

Impeding Dendritic Corrosion in Silicone Gel-Potted Power Module Isolation Trenches by Heating references Optotherm’s high-resolution thermal imaging system to characterize temperature distribution and validate the effectiveness of the heating approach in improving power module reliability.

ietresearch.onlinelibrary.wiley.com/doi/10.1049/pel2.70078


IEEE Xplore | 2024

Monolithic Integrated Micro-Thin-Film Thermocouples for On-Chip Temperature Measurement of GaN HEMTs includes an Optotherm thermal graph, illustrating microheater temperature distribution, supporting validation of localized heating behavior and device-level thermal response.

ieeexplore.ieee.org/document/10750147 


IEEE Xplore | 2022

Impact of Inherent Design Limitat​ions for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs employs Sentris from Optotherm Inc. for lock-in thermography (LiT) to locate the failure zones in stressed chips.

https://ieeexplore.ieee.org/document/9969996


Microelectronics Reliability | 2021

A Humidity-Induced Novel Failure Mechanism in Power Semiconductor Diodes discusses how Lock-in thermography microscopy was used to localize failure hotspots using an Optotherm Sentris system.

https://www.sciencedirect.com/science/article/pii/S0026271421001736?via%3Dihub


IEEE Xplore | 2018

Evaluation of LPCVD SiNx gate dielectric reliability by TDDB measurement in si-substrate-based AlGaN/GaN MIS-HEMT References an Optotherm thermal imaging microscope used to observe thermal variation induced by leakage current and to analyze the failure mechanism.

https://ieeexplore.ieee.org/document/8330030


Micro & Nano Letters | 2015

Out-of-plane buckled cantilever microstructures with adjustable angular positions using thermal bimorph actuation for transducer applications references an Optotherm thermal imaging camera used to perform thermal characterization of microscale components.

https://ietresearch.onlinelibrary.wiley.com/doi/10.1049/mnl.2015.0198