SEIPI | 2025
Non-Destructive Package-Level Fault Localization in CSP-BGA Devices references an Optotherm high-resolution lock-in thermography system as a critical tool for precise, non-destructive fault localization in advanced semiconductor packages.
IET Power Electronics | 2025
Impeding Dendritic Corrosion in Silicone Gel-Potted Power Module Isolation Trenches by Heating references Optotherm’s Sentris high-resolution thermal imaging system to characterize temperature distribution and validate the effectiveness of the heating approach in improving power module reliability.
IEEE Xplore | 2024
Monolithic Integrated Micro-Thin-Film Thermocouples for On-Chip Temperature Measurement of GaN HEMTs captures infrared thermal graphs of the microheater using an Optotherm thermal imaging system for thermal analysis.
IEEE Xplore | 2022
Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs employs Optotherm's Sentris for lock-in thermography to locate the failure zones in stressed chips.
Microelectronics Reliability | 2021
A Humidity-Induced Novel Failure Mechanism in Power Semiconductor Diodes discusses how lock-in thermography microscopy was used to localize failure hotspots using an Optotherm Sentris system.
IEEE Xplore | 2018
Evaluation of LPCVD SiNx gate dielectric reliability by TDDB measurement in si-substrate-based AlGaN/GaN MIS-HEMT References an Optotherm thermal imaging microscope used to observe thermal variation induced by leakage current and to analyze the failure mechanism.
Micro & Nano Letters | 2015
Out-of-plane buckled cantilever microstructures with adjustable angular positions using thermal bimorph actuation for transducer applications employs an Optotherm's InfraSight MI320 thermal imaging camera to perform thermal characterization of microscale components.