Electronics Failure Analysis System

Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.

Using a non-destructive process called lock-in thermography, failures can be isolated on both bare (front or backside) and packaged devices without the need for surface treatment or coating. Sentris can also locate low-power fail sites on SMD components, such as capacitor leakage. The x, y position of defect sites can be located, as well as defect depth. Depth analysis can be very helpful when isolating faults in stacked die packages.

In addition to fault isolation, Sentris also includes thermal analysis tools for true temperature mapping, junction temperature measurement, die attach evaluation, and thermal resistance evaluation.

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                Included Components

                Sentris is supplied as a complete, fully tested system that includes all of the following components. Click on a component below to view more information.

                Optional Components

                The following components offer additional functionality to Sentris. Click on a component below to view more information.

                Our systems are a fraction of the cost of competing MWIR systems

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