Device Flip Probing Platform
PN0335 is used to probe a device or wafer and flip to image the opposite side. Devices are mounted in magnetic chucks made of non-conductive Delrin. Terminal blocks manage voltage source and probe lead connections so the platform can flip upside down. The platform accommodates devices up to 80 mm wide.
Flip chip ball grid array analysis
Magnetic 304 stainless steel platform
Set of 4 die holders
Set of 4 terminal blocks (4-position)
Terminal block test leads
|Dimensions||35.5 x 20 x 18cm|
|Maximum device size (for die holders)||80 x 80mm|
The platform base can be mounted in the following configurations:
Connect to the mounting table using the four (4) M6 thumbscrews provided.
Connect to the XY Device Stage using the four (4) M4 thumbscrews provided.