Company Overview
Optotherm, Inc. designs and manufactures infrared cameras, optical assemblies, image analysis software, and turn-key infrared camera systems. In 2002, we developed our first thermal imaging system for circuit board failure analysis and have since expanded into semiconductor failure analysis and microscopic thermal analysis.
Company Name: Optotherm, Inc.
Headquarters: Warrendale, Pennsylvania, USA
Founded: 2000
Website: www.optotherm.com
Email: sales@optotherm.com
Phone: +1 (724) 940-7600
YouTube: youtube.com/@Optotherm
LinkedIn: https://www.linkedin.com/company/optotherm-inc/
Optotherm Sentris Electronics Failure Analysis Systems
Using high sensitivity Lock-in Thermography fault isolation, Sentris detects and locates low-level heating associated with leakage current and resistive shorts in semiconductors and printed circuit boards. Sentris Lock-in Photometry software detects and locates faults such as latch-ups and gate oxide defects on semiconductor devices by detecting emitted photons in the short wave infrared (SWIR) region of the electromagnetic spectrum. Optotherm provides turnkey failure analysis systems that are configured to each customer's application.
Electronic Devices Tested
- Semiconductor packages
- Decapsulated devices
- Semiconductor wafers
- SMD components
- Printed circuit boards
- Printed circuit board assemblies
- Flex circuits
Faults Detected
- Leakage current
- Resistive shorts
- Gate/drain shorts
- Package mold compound shorts
- Metallization shorts
- ESD related faults
- Latch-up sites
- Oxide layer breakdown
Industries Served
- Integrated circuit design and manufacturing
- Printed circuit board manufacturing
- Printed circuit board assembly manufacturing
- Electronics failure analysis laboratories
- Materials science design and manufacturing
- MEMS research
- Academic research & design laboratories
References in Research
Optotherm, Inc. systems are referenced in peer-reviewed research papers and used by leading universities and semiconductor labs worldwide.
Tian, F., Zhou, T., Zhang, X., Chen, R., & Chen, S. (2025). Electrically pumped surface-emitting amplified spontaneous emission from colloidal quantum dots. Light: Science & Applications, 14(279). https://www.nature.com/articles/s41377-025-01972-1
Asuncion, C., Raborar, M., & Mendaros, R. (2025). Non-destructive package-level fault localization in chip-scale package ball-grid array (CSP-BGA) devices through lock-in thermography and time-domain reflectometry (TDR). ASEMEP National Technical Symposium (SEIPI). https://seipi.org.ph/wp-content/uploads/2025/05/NON-DESTRUCTIVE-PACKAGE-LEVEL-FAULT-LOCALIZATION-IN-CHIP-SCALE-PACKAGE-BALL-GRID-ARRAY-CSP-BGA-DEVICES.pdf
Rautio, J., Kärkkäinen, T., Niemelä, M., Silventoinen, P., Lohtander, L., Leppänen, J., & Ingman, J. (2025). Impeding dendritic corrosion in silicone gel potted power modules through surface heating. IET Power Electronics, 18(1). https://ietresearch.onlinelibrary.wiley.com/doi/10.1049/pel2.70078
Bhatti, H. (2025). On-chip calibration of microscale thermocouples for precise temperature measurement. arXiv. https://arxiv.org/pdf/2503.18728
Bhatti, H. (2025). Monolithic integration and calibration of micro-thin film thermocouples for in situ thermal characterization of wide and ultrawide bandgap semiconductor devices. KAUST Research Repository.https://repository.kaust.edu.sa/server/api/core/bitstreams/c534940c-0c93-4a64-bd17-2b81288b28bc/content
Li, L., Gao, B., Chen, T., Ng, C., Wang, Y., Huang, Q., Sun, K., Shou, Y., Ma, Y., Chen, H., & Li, Y. (2025). Omnidirectional circularly polarized thermal radiation enabled by chiral metasurface. Small Structures. https://onlinelibrary.wiley.com/doi/10.1002/sstr.202500363
Bhatti, H., Yuvaraja, S., Wang, C., Tang, X., & Li, X. (2024). Monolithic integrated micro-thin-film thermocouples for on-chip temperature measurement of GaN HEMPTs. IEEE Transactions on Electron Devices, 71(12). https://ieeexplore.ieee.org/abstract/document/10750147
Li, J., Li, J., Liu, H., & Yi, F. (2024). Phonon-mediated infrared plasmonic metamaterial emitters towards high-capacity multifunctional encoding and display. Optics Express, 32(16). https://opg.optica.org/oe/fulltext.cfm?uri=oe-32-16-28489
Stoukatch, S., Dupont, F., Laurent, P., & Redouté, J. (2023). Package design thermal optimization for metal-oxide gas sensors by finite element modeling and infra-red imaging characterization. Materials, 16(18), 6202. https://doi.org/10.3390/ma16186202
Tiwary, N., Ross, G., Vuorinen, V., & Paulasto-Kröckel, M. (2022). Impact of inherent design limitations for Cu–Sn SLID microbumps on its electromigration reliability for 3D ICs. IEEE Transactions on Electron Devices, 70(1), 222–229. https://ieeexplore.ieee.org/document/9969996
Leppänen, J., Ross, G., Vuorinen, V., Ingman, J., Jormanainen, J., & Paulasto-Kröckel, M. (2021). A humidity-induced novel failure mechanism in power semiconductor modules. Microelectronics Reliability, 120.https://www.sciencedirect.com/science/article/pii/S0026271421001736
Chen, Y., Li, M., Yan, W., Zhuang, X., Wei, K., & Cheng, X. (2021). Sensitive and low-power metal oxide gas sensors with a low-cost microelectromechanical heater. ACS Omega. https://pubs.acs.org/doi/full/10.1021/acsomega.0c04340
Li, J., Li, J., Zhou, H., Zhuang, G., Liu, H., Wang, S., & Yi, F. (2021). Plasmonic metamaterial absorbers with strong coupling effects for small pixel infrared detectors. Optics Express, 29(15). https://opg.optica.org/oe/fulltext.cfm?uri=oe-29-15-22907
Xu, R., & Lin, Y. (2020). Tunable infrared metamaterial emitter for gas sensing application. Nanomaterials, 10(8), 1442. https://www.mdpi.com/2079-4991/10/8/1442
Qi, Y., Zhu, Y., Zhang, J., Lin, X., Cheng, K., Jiang, L., & Yu, H. (2018). Evaluation of LPCVD SiNx gate dielectric reliability by TDDB measurement in Si-substrate-based AlGaN/GaN MIS-HEMT. IEEE Transactions on Electron Devices, 65(5), 1759–1764. https://ieeexplore.ieee.org/document/8330030
Yao, Y., An, Y., Tu, K.N., & Liu, Y. (2024). Influence factors of joule heating in microbump in advanced packaging technology. 2024 25th International Conference on Electronic Packaging Technology (ICEPT). https://ieeexplore.ieee.org/document/10668533
Stoukatch, S., Fagnard, J., Roy, G., Laurent, P., Dupont, F., Jacques, P., & Redouté, J. (2022). Thermal conductivity characterization of an in-house formulated thermal insulating xerogel-epoxy composite adhesive for electronics applications. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC). https://ieeexplore.ieee.org/document/9939477