Device Probing Package
The device probing package includes the following items required for making electrical contact with bare semiconductor pads and device package leads:
- Probing platform
- Probe positioners
The probing platform provides a sturdy base on which to probe and power IC devices and die. The platform is manufactured from magnetic 410 stainless steel and is ground to a smooth, flat surface for use with magnetic probe positioners.
Probe positioners enable precise positioning of needle probes
onto semiconductor pads. Each positioner has a magnetic
base and can be adjusted in the x, y, and z directions with +/-
7.5mm movement along each axis. The test arm can swivel
and be adjusted in the z direction using a thumbscrew. The needle
probe position on the test arm can also be adjusted using a
thumbscrew. A wire lead with gold-plated contact pin is used
to make electrical connection to the needle probe.
Note: Probe positioners are offered in both left and right hand versions. The right hand version is shown on the right.