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Micro Infrared Microscope

Semiconductor and MEMS Device Thermal Analysis

 

As electronic devices continue to decrease in size, heat generation and thermal dissipation become increasingly important.  The Micro thermal microscope can measure and display the temperature distribution over the surface of semiconductor devices, enabling quick detection of hot spots and thermal gradients which can indicate a defect site and frequently lead to decreased efficiency and early failure.

 

In the development of micro-electro-mechanical systems (MEMS), such as microreactors, micro heat exchange systems, microactuators, and microsensors, spatial temperature distribution and thermal response time are among the most important parameters.  Because a non-contact approach is required to measure the temperature of MEMS components, the Micro infrared microscope is a powerful tool for microthermographic characterization, providing detailed thermographic images with 20μm spatial resolution.

 

The Micro infrared microscope can even be used to perform failure analysis on circuit boards.  Defective and marginal components can be identified using a proprietary software tool called Model Board Comparison and the Find Shorts software tool helps detect and locate difficult-to-find short circuits.

 

 

Hardware Components

In addition to the OptoTherm infrared microscopic camera, Micro includes additional hardware tools that are necessary when analyzing and troubleshooting semiconductor devices and micro systems.  The optical mounting table provides a sturdy platform with vibration isolation on which to perform sensitive testing.  Precise camera focusing and positioning is accomplished using the vertical focus stage.  Areas of interest on a device can be quickly and accurately positioned within the camera’s field-of-view using the XY stage.  The thermal stage provides both heating and cooling for precise temperature control of integrated circuits (ICs) and MEMS devices.

 

System Features

  • 20μm fixed focus lens with 0.2°C sensitivity

  • 50° focusable lens with 0.05°C sensitivity

  • 30 images/second capture and display

  • 0 to 300°C temperature measurement

  • Sophisticated hot spot detection

  • Golden board comparison

  • Quick startup - less than 1 minute

 

 

 

 

Applications

  • Semiconductor die thermal inspection

  • Detect hot spots and shorts on ICs

  • Detect and locate defects on both components and boards

  • Measure the temperature of semiconductor junctions

  • Identify semiconductor die bond defects

  • Measure packaged die thermal resistance

  • Establish thermal design rules

  • Laser diode characterization and failure analysis

  • MEMS thermographic analysis

  • Fiber optic thermographic inspection

  • Measure the heat transfer efficiency of micro heat exchangers

  • Semiconductor gas sensor thermal analysis

  • Microreactor thermographic characterization

  • Microactuator temperature measurement

  • Biological specimen temperature analysis

  • Thermal inspection of materials

  • Thermo-fluids analysis

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