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THERMAL IMAGING PRODUCTS
ThermoScreen
Micro
EL
Introduction
 Overview
Applications
How
It Works
Example
Defects
Short
Detection
Model
Board Comparison
EL
Software
System Components
Specifications
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 sales@optotherm.com
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 EL Infrared Circuit Board
Inspection System
Background
Why Is ELNeeded?
Increasing Board Complexity
The complexity of PCB
manufacturing has increased dramatically over the last three decades,
progressing from straightforward double-sided boards with 100% through-hole
technology to highly complex multi-layer PCBs with mixtures of through-hole,
surface mount and chip-on-board configurations. Board layouts have
consequently increased in density with tighter tolerances and decreased
distances between electrical contacts. With this increase in
complexity, the possibility of manufacturing defects has increased.
Conventional Test Limitations
Increasing board complexity places limits on the
effectiveness of conventional inspection and test strategies. AOI does
not have the ability to discern if a component is defective or if a
board has a hidden short. ICT often cannot test an
entire board due to limited access to test points. Critical sections of the board, such as the
integrity of hidden solder joints under a BGA, often cannot be tested using
conventional test methods. Furthermore, neither ICT nor AOI can detect latent component defects such as resistive shorts, delaminations, and thermal management problems.
A particularly difficult problem is the inability to identify stressed
components using conventional test technologies. Stressed components
can pass ICT and FCT only to fail early in the field.
Thin Operating Margins
Because
the
cost saving demands by OEMs require contract manufacturers to operate with
razor thin operating margins, there is a need for
efficient and cost-effective failure analysis.
Lead-Free Solder
Because lead-free alloys melt at higher
temperatures, their application can unduly stress ICs and components and
can lead to increased solder related defects such as bridging, poor
wetting, and voids. Engineers may
not yet have a full understanding of the variety of defects and failure
modes that the implementation of a lead-free solder process.
How EL Can Help You
Thermal
imaging is a combination of inspection and test technologies and bridges the
gaps between conventional test technologies. EL is fast, easy-to-use, cost effective, and
provides long-term advantages. Board failures are often symptomatic of
problems within the manufacturing process or with the design itself. The
sooner a defect can be identified, the more quickly the underlying cause can
be rectified.
For example, if a defect stems from design problems rather than the assembly
process, a contract manufacturer can recommend a simple redesign to their customers.
EL can be used at every stage of the production process.
In the design phase, EL can help create designs that avoid heat
concentration and optimize thermal distribution, enhancing reliability and life
span. When implemented after
conventional tests, EL can identify defects (ex, resistive shorts and
stressed components) that
these tests may have missed.
Programming ICT and
setting up AOI and AXI tests are often long and laborious tasks.
Because of its fast and simple deployment process, EL
is being used at all levels of the manufacturing process.
Increased
competition and shorter product life cycles are forcing OEMs to get their
products to the end-user as quickly as possible.
The shorter deployment time
for EL can help improve the speed and frequency of new
product launches.
Failure Modes Detected
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Interlayer, hidden, and resistive shorts
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Faulty components
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Stressed components
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Latent defects
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Heat sink and die attach problems
Benefits
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Better fault
coverage
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Improved
reliability in the field by screening latent defects
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High return on
investment
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Eliminate scrap
piles
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Reduce repair
times in the rework cycle
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Improve yields
on the production line
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Improve process
quality
Features
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Short setup
time
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No programming or custom tooling required
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Statistical golden board model comparison with defect
database
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High sensitivity short detection
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